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Product Specifications |
8-layer immersion gold plating PCB |
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Product Model Number |
003 |
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Product Name |
Multilayer PCB |
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Country of Origin |
PEOPLE REPUBLIC OF CHINA |
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Product Short Description |
8-layer immersion gold plating PCB |
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Selling Point |
Fine-line high density quick turn prototype and small volume pcb |
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Primary Competitive Advantages |
Short leading time, Prototype and Small Quantity, multilayer |
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Key Product Specifications / Features |
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1 |
Quick-turn prototype and small-quantity PCBs |
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2 |
35um (thickness) copper |
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3 |
Base lamination: FR4 |
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4 |
Board thickness: 1.8mm (0.071 inch) |
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Board size: 170.00 x 110.00 mm ( 6.69 x 4.33 inch) |
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PCB layers: 8-layer board |
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7 |
Min Conductor width: 0.13 mm (5 mil) |
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Min Conductor spacing: 0.13 mm (5 mil) |
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Min Size of plated through holes: 0.25 mm (10 mil) |
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Min Pad diameter: 0.50 mm (20 mil) |
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11 |
The Surface treatment type: Immersion Gold |
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Min Ni thickness: >5um, Min Au thickness: >0.05um |
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CAD: Gerber file (RS274-X) |
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Value of Minimum Order |
1-9pcs |
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Payment Terms |
T/T net 30days |
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Delivery Lead Time |
5 working days |
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FOB Port |
SHENZHEN |
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FOB Price Range |
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Safety / Quality Approvals |
UL E204460 / DNV ISO 9001 01527-99-AQ-LDN-UKAS |
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