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Product Specifications |
20-layer Backplane PCB for Telecom |
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Product Model Number |
002 |
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Product Name |
20-layer PCB |
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Country of Origin |
PEOPLE REPUBLIC OF CHINA |
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Product Short Description |
20-layer Backplane PCB |
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Selling Point |
Fine-line high density quick turn prototype and small volume pcb |
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Primary Competitive Advantages |
Short leading time, Prototype and Small Quantity, multilayer |
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Key Product Specifications / Features |
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1 |
Quick-turn prototype and small-quantity PCBs |
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2 |
35um (thickness) copper |
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3 |
Base lamination: FR4 |
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4 |
Board thickness: 5.5mm (0.216 inch) |
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Board size: 650.00 x 300.00mm (25.60 x 11.81 inch) |
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6 |
PCB layers: 20-layer board |
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Min Conductor width: 0.20 mm (8 mil) |
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Min Conductor spacing: 0.20 mm (8 mil) |
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Min Size of plated through holes: 0.65 mm (26 mil) |
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Min Pad diameter: 1.30 mm (52 mil) |
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Aspect Ratio: 8.57:1 |
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The Surface treatment type: Immersion Gold |
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13 |
CAD: Gerber file (RS274-X) |
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14 |
Impedance control value: 50OHM +/-10% |
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Value of Minimum Order |
1-9pcs |
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Payment Terms |
T/T net 30days |
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Delivery Lead Time |
15 working days |
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FOB Port |
SHENZHEN |
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FOB Price Range |
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Safety / Quality Approvals |
UL E204460 / DNV ISO 9001 01527-99-AQ-LDN-UKAS |
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